Inspection Material: Semiconductor
Process Flow: Final Product Inspection
Customer Requirement: Detection of wafer edge defects under microscopic conditions with an accuracy of up to 1.5µm.
Project Description：
Innovative Profile：
Wafer Edge Inspection Solution
Equipment Inspection vs. Manual Inspection
Yield Improvement
False Positive
＜1%
10%
50-fold
AI Module: u-eyes studio algorithm module
Core Function: A critical link in the wafer quality control process, strengthening the quality assurance line.
Defect Detection: Capable of identifying multiple types of defects, including debris, scratches, micro-cracks, and etching residue.
Coverage Area: Comprehensive coverage of the wafer edge face and the connected top and bottom surfaces.
Scanning Design: Employs a three-directional scanning approach to ensure comprehensive and accurate defect detection.
Defect Images
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